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清华大学学报(自然科学版)  2015, Vol. 55 Issue (7): 750-755    
  机械工程 本期目录 | 过刊浏览 | 高级检索 |
CMP多区压力定量解耦协同控制
门延武, 张辉, 姜文雪, 周凯, 叶佩青
清华大学 制造工程研究所, 北京 100084
Quantitative decoupling cooperative control of CMP multi-zone pressure systems
MEN Yanwu, ZHANG Hui, JIANG Wenxue, ZHOU Kai, YE Peiqing
Institute of Manufacturing Engineering, Tsinghua University, Beijing 100084, China
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摘要 化学机械抛光(CMP)过程中由于柔性弹性隔膜的存在使得各区之间压力相互耦合, 导致多区压力控制变得复杂化。该文提出了一种基于工作点线性化方法的离线辨识+定量耦合度分析+定量解耦控制的方案。利用工作点线性化方法, 离线获得多区压力系统的3输入3输出模型; 通过相对增益矩阵方法定量分析出各区之间的耦合程度; 采用前馈补偿解耦控制器实现各区压力之间的定量解耦控制。仿真以及实验结果表明:该方案在工程实践中能够实现各区压力的定量解耦控制, 使得系统在相同控制算法下获得更快的响应速度以及更小的超调量。
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门延武
张辉
姜文雪
周凯
叶佩青
关键词 化学机械抛光(CMP)多输入多输出(MIMO)定量解耦相对增益矩阵    
Abstract:Chemical mechanical polishing (CMP) has a flexible elastic diaphragm that couples the mechanical deformations of the parts and complicates the pressure control. The coupling problem is solved here using offline identification based on working point linearization + quantitative coupling analysis + quantitative decoupled cooperative control. The working point linearization gives a multi-zones model. The relative gain array (RGA) method gives the degree of coupling. The feed-forward compensation decoupling controller provides the quantitative decoupling. Simulations and experiments show that this method decouples the pressure system in the multiple zones in engineering practice, so the system has less overshoot and faster response with the same control method.
Key wordschemical mechanical polishing (CMP)    multiple-input multiple-output (MIMO)    quantitative decoupling    relative gain array (RGA)
收稿日期: 2014-04-03      出版日期: 2015-09-18
ZTFLH:  TH16  
通讯作者: 周凯,教授,E-mail:zhoukai@mail.tsinghua.edu.cn     E-mail: zhoukai@mail.tsinghua.edu.cn
引用本文:   
门延武, 张辉, 姜文雪, 周凯, 叶佩青. CMP多区压力定量解耦协同控制[J]. 清华大学学报(自然科学版), 2015, 55(7): 750-755.
MEN Yanwu, ZHANG Hui, JIANG Wenxue, ZHOU Kai, YE Peiqing. Quantitative decoupling cooperative control of CMP multi-zone pressure systems. Journal of Tsinghua University(Science and Technology), 2015, 55(7): 750-755.
链接本文:  
http://jst.tsinghuajournals.com/CN/  或          http://jst.tsinghuajournals.com/CN/Y2015/V55/I7/750
  图1 抛光头内部结构示意图
  表1 仿真得到的解耦前后各区同时加压阶跃响应性能指标对比
  图2  解耦后多区控制系统simulink仿真图
  图3  解耦前后多区压力控制系统响应仿真曲线
  表2 实验得到的解耦前后各区同时加压阶跃响应性能指标对比
  图4 实验使用的CMP装备
  图5 解耦前后多区压力控制系统响应实验结果曲线
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