Stress uniformity of spacecraft multilayer thermal insulation components
LIU Yue1, SUO Shuangfu2, GUO Fei2, HUANG Min1, SUN Weiwei1, TAN Botao1, HUANG Shouqing3, LI Fangyong3
1. Ministry of Education Key Laboratory of Modern Measurement and Control Technology, Mechanical Electrical Engineering School, Beijing Information Science & Technology University, Beijing 100192, China; 2. State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China; 3. Beijing Key Laboratory of Environment & Reliability Test Technology for Aerospace Mechanical & Electrical Products, Beijing Institute of Spacecraft Environment Engineering, Beijing 100094, China
Abstract：[Objective］ Multilayer thermal insulation components are key parts for thermal insulation and depressurization on the outer surface of a spacecraft, with the structure comprising primarily of multilayer thin films and nylon nets. However, during the process of spacecraft launch, the internal gas in the multilayer thermal insulation components rapidly flows out because of the rapid decrease in external pressure. Furthermore, the internal flow field changes considerably, resulting in the deformation of the multilayer thermal insulation components. Under certain pressure differential conditions, the stress on each thin film is nonuniform, and structural failure may occur on a certain thin film layer due to extreme stress. Thus, the stress uniformity of the multilayer thermal insulation components is a key indicator of structural failure. This paper proposes an evaluation indicator to assess the thin film stress uniformity of the multilayer thermal insulation components. ［Methods］ Three-dimensional slice models of the multilayer thermal insulation components are established, and the computational fluid dynamics method is adopted to analyze the internal flow field distribution and stress on each thin film during the depressurization process. Through the systematic analysis of the fluid pressure differential on each thin film, the thin film pressure differential coefficient is proposed as an evaluation indicator for stress uniformity. Furthermore, four typical structural parameters, namely the number of layers, thickness of the film, diameter of the hole, and distance of the hole, are selected within the extreme design range of various structural parameters of the multilayer thermal insulation components, and the orthogonal experimental design method is employed to analyze these structural parameters and determine the influence law of the structural parameters on the thin film pressure differential coefficient. Finally, a mathematical analytical model for calculating the thin film pressure differential coefficient is proposed based on the influence law. ［Results］ The orthogonal experimental results revealed that the four typical structural parameters had different degrees of influence on the thin film pressure differential coefficient. The thickness of the film had the highest degree of influence, whereas the diameter of the hole had the lowest degree of influence. The results of the mathematical analysis and computational fluid dynamics methods were compared, and the results revealed that: (1) For a single-hole thin film structure, the maximum error in results between the mathematical analytical model and the computational fluid dynamics model was 4.5%. (2) For a double-hole thin film structure, the maximum error in results between the mathematical analytical model and the computational fluid dynamics model was 5.3%. (3) The mathematical analytical method was accurate and fast. ［Conclusions］ This paper reveals the internal flow field distribution and the film stress of multilayer thermal insulation components using a three-dimensional slice model and proposes the thin film pressure differential coefficient as a key indicator of stress uniformity. Furthermore, this paper proposes a feasible and effective mathematical analytical model to rapidly evaluate the thin film stress uniformity by exploring the influence law of the four typical structural parameters on the thin film pressure differential coefficient through the orthogonal experimental test. The proposed mathematical analytical method can be used to rapidly calculate the pressure differential coefficient, which provides a basis for judging the stress uniformity of the multilayer thermal insulation components during spacecraft launch, thereby preventing the failure of the multilayer thermal insulation components.
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2023, Vol. 63 
