Techniques of speckle fabrication and imgae processing for high temperature digital image correlation

DUAN Qiyuan; GONG Wenran; GUO Baoqiao; WU Lifu; YU Xingzhe; XIE Huimin

doi:10.16511/j.cnki.qhdxxb.2019.26.006

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Journal of Tsinghua University(Science and Technology) ›› 2019, Vol. 59 ›› Issue (6) : 425-431. DOI: 10.16511/j.cnki.qhdxxb.2019.26.006

AEROSPACE AND ENGINEERING MECHANICS

Techniques of speckle fabrication and imgae processing for high temperature digital image correlation

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Abstract

According to requirement of the high-temperature application from the digital image correlation (DIC) method, the speckle fabrication methods and high-temperature speckle image processing technique are studied in this paper. Taking high-temperature structural materials as the studied objects, a high-temperature speckle fabrication technique based on parametric template is developed. The technique is mainly based on a parametric template, which can adjust the parameters such as particle size, distribution density, and randomness in the template. As a result, the quality of the speckle can be optimized. A high-temperature speckle pattern was successful fabricated on the C-SiC composite substrate by the proposed technique, and the experiment verifies the speckle carrier can endure high temperature up to 1 200℃. At the same time, the influence factors of thermal disturbance and thermal radiation on DIC measurement results are analyzed. The high-temperature speckle images are corrected with approaches of image grayscale-average, circulating thermal disturbance and optical filtering method. And a test for measuring the thermal expansion coefficient is designed to verify the feasibility of the correction methods.

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high temperature / digital image correlation / thermal disturbance / thermal radiation, speckle pattern

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DUAN Qiyuan, GONG Wenran, GUO Baoqiao, WU Lifu, YU Xingzhe, XIE Huimin. Techniques of speckle fabrication and imgae processing for high temperature digital image correlation[J]. Journal of Tsinghua University(Science and Technology). 2019, 59(6): 425-431 https://doi.org/10.16511/j.cnki.qhdxxb.2019.26.006

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