Thermofluid modeling for concurrent size-topology optimization of heat sinks for planar motors

ZHAO Jiaqi; ZHANG Ming; ZHU Yu; CHENG Rong; LI Xin; WANG Leijie; HU Chuxiong

doi:10.16511/j.cnki.qhdxxb.2022.25.007

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Journal of Tsinghua University(Science and Technology) ›› 2022, Vol. 62 ›› Issue (3) : 400-407. DOI: 10.16511/j.cnki.qhdxxb.2022.25.007

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Thermofluid modeling for concurrent size-topology optimization of heat sinks for planar motors

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Abstract

The thermal-hydraulics of water-cooled heat sinks for planar motors were analyzed using a thermofluid model of a heat sink to concurrently optimize the heat sink size and topology. The three-layer thermofluid model of the heat sink included the coupled flow and heat transfer effects between the cover plates and the fluid-solid mixing channel including the influence of the flow channel thickness on the thermal-hydraulics. The model used a porosity model to describe the channel topology and a continuous-adjoint structural optimization model for the geometric variables related to the channel topology and thickness in a concurrent size-topology optimization scheme. Various numerical examples show the accuracy and efficiency of the three-layer thermofluid model and the size-topology optimization scheme. The three-layer model uses 10% less calculational time than full 3D models while still accurately predicting the temperature distribution. The optimized heat sinks have unique topologies with up to 30.82% better heat transfer than baseline designs. This concurrent approach is efficient and obtains designs that are competitive with discrete optimization approach results.

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heat sink / thermofluid modeling / multi-layer model / topology optimization / size optimization / concurrent optimization

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ZHAO Jiaqi, ZHANG Ming, ZHU Yu, CHENG Rong, LI Xin, WANG Leijie, HU Chuxiong. Thermofluid modeling for concurrent size-topology optimization of heat sinks for planar motors[J]. Journal of Tsinghua University(Science and Technology). 2022, 62(3): 400-407 https://doi.org/10.16511/j.cnki.qhdxxb.2022.25.007

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