中国固体实验包层增殖子模块的温度场模拟

Journal of Tsinghua University(Science and Technology) ›› 2013, Vol. 53 ›› Issue (1) : 102-105.

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Journal of Tsinghua University(Science and Technology) ›› 2013, Vol. 53 ›› Issue (1) : 102-105.

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